New Honor 30S Teasers assures Punch-hole Display, Side-mounted Fingerprint, and Quad cameras

Honour will be launching the Honor 30S in China on March 30 as planned. Ever since the launch date was published, the brand has been teasing the design and specific specs of the handset on Weibo. Now, a new set of teasers reveals the phone’s front, side and back.

Glory Cheung, Strategi and Cheif Brand Officer of Honour, has shared three teaser renders of the newly coming Honor 30S since March 26. The first teaser poster disclosed the back of the device, which houses a quad-camera setup at the top left corner. The cameras are symmetrically arranged in a rectangular block with three sensors on one side separated by a line with one sensor, LED flash as well as AI branding on the other side. Furthermore, the rear panel of the device features a gradient design much inspired by the wings of butterflies as regards the brand executives.

The second teaser poster reveals to us the right side of Honor 30S housing volume rockers and the power key with an integrated fingerprint sensor. In addition, this render also gives us an idea about the bump of the camera array, which interestingly looks to be slimmer than the competition even though the phone is tipped to feature a custom large primary sensor with 64 megapixels.
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Finally, the latest teaser shared today gives us the first-ever clear glimpse of the device’s front. This confirms the forthcoming Honor 30S to sport a punch-hole display, which was somewhat visible in the teaser for 40W fast charging support posted by the brand yesterday. Also, the punch-hole sits at the top left corner and seems to be smaller than other mid-range smartphones.

All the teasers posted by Honor’s Zhang Xiaoyun flaunted the Honor 30S in Green colour, which was leaked a couple of days back. Apart from this colour, the handset is also expected to arrive in Blue and Orange gradients. Anyway, the biggest star of this smartphone will be the new HiSilicon Kirin 820 5G chipset, which has been confirmed to outperform Qualcomm Snapdragon 765G and HiSilicon Kirin 980.

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