HomeAndriodHonor President: HiSilicon Kirin 985 SoC bridges the gap between the Kirin...

Honor President: HiSilicon Kirin 985 SoC bridges the gap between the Kirin 820 and 990

Yesterday (15th April 2020), Honor, the Huawei subsidiary, had unveiled the company’s latest mobile processor, the Kirin 985 SoC. The chipset is an octa core processor and is 5G enabled. Now, George Zhao, the President of Honor, has stated that the chipset will be positioned between the flagship Kirin 990 and mid range Kirin 820 chipset, and will be aimed at device priced under 3000 Yuan (roughly 420 US Dollars).

The HiSilicon Kirin 985 5G chipset has been proprietarily developed and is the third 5G ready mobile processor that the company has launched. In an interview, the senior Honor official answered questions regarding its newly launched chip. According to George, the Kirin 985 SoC is meant to act as a bridge and fill the gap between the Kirin 990 and Kirin 820.

The processor is a flagship unit and will be shipped with devices carrying a price tag under 3,000 Yuan. In other words, it will be a more viable offering in budget flagship smartphones that does not compromise too much on performance over the company’s faster Kirin 990 5G SoC. The Chinese tech giant is placing an increasing emphasis on 5G networking as it is the future of smartphones and cellular data.

The HiSilicon Kirin 985 houses an integrated 5G modem alongside the new Mali-G77 GPU. It also features the same dual core NPU as the Kirin 990 and has been specifically designed for improvements on “processing power, communication capabilities, thermal and structural design.” Previously, we had reported on the processor crossing the 380,000 mark on AnTuTu benchmark ratings, so it seems that the chip is powerful, to say the least.


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